Details
Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8
Proceedings of the 2013 Annual Conference on Experimental and Applied MechanicsConference Proceedings of the Society for Experimental Mechanics Series
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213,99 € |
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| Verlag: | Springer |
| Format: | |
| Veröffentl.: | 27.08.2013 |
| ISBN/EAN: | 9783319008769 |
| Sprache: | englisch |
Dieses eBook enthält ein Wasserzeichen.
Beschreibungen
<p><i>Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems, Volume 8: </i><i>Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics</i>, the eighth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: </p><p> </p><p>Advances in Residual Stress Measurement Methods</p><p>Residual Stress Effects on Material Performance</p><p>Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement</p><p>Thermomechanics & Infrared Imaging</p><p>Inverse Methods</p><p>Inverse Methods in Plasticity</p><p>Applications in Experimental Mechanics</p>
From the Contents: Analysis of Thrust Production in Small Synthetic Flapping Wings.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part I: Discretization and Algorithm.- Coarse-resolution Cone-beam Scanning of Logs Using Eulerian CT Reconstruction. Part II: Hardware Design and Demonstration.- Crack Nucleation Threshold Under Fretting Loading by a Thermal Method.- Crack Growth Study of Fibre Metal Laminates Using Thermoelastic Stress Analysis.- Crack Detection in Large Welded Components Under Fatigue Using TSA.- Hybrid Thermoelastic Analysis of an Unsymmetrically-loaded Structure containing an Arbitrarily-shaped Cutout.- Quantitative Themographic Characterization of Composites.- Thermal Deformation of Micro-structure Diffuser Plate in LED Backlight Unit.- Polariscopy Measurement of Residual Stress in Thin Silicon Wafers.
<p>This critical collection presents early findings and case studies on a wide range of areas, as presented in the Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics. The collection includes papers in the following general technical research areas:</p><p>• Advances in Residual Stress Measurement Methods</p><p>• Residual Stress Effects on Material Performance</p><p>• Optical, Ultrasonic, and Diffraction Methods for Residual Stress Measurement</p><p>• Thermomechanics & Infrared Imaging</p><p>• Inverse Methods</p><p>• Inverse Methods in Plasticity</p><p>• Applications in Experimental Mechanics</p><p><i>Residual Stress, Thermomechanics & Infrared Imaging, Hybrid Techniques and Inverse Problems: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics</i> is the eighth volume of eight from the Conference.</p><p>
Includes supplementary material: sn.pub/extras
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